—Capacitive Micromachined Ultrasonic Transducers (CMUTs) are generally fabricated possibly by regular sacrificial release process or by wafer bonding technique. During the former, sacrificial levels are patterned with deposited components around the substrate. This present work reports a development on the aforementioned technique wherein sacrificial islands are embedded within groove... https://spencerfygv034.hpage.com/post4.html